BS EN 60068-2-20-2008 环境测试.试验.试验T.含铅装置热钎焊阻力和软焊性的试验方法
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【英文标准名称】:Environmentaltesting-Part2-20:Tests–TestT:Testmethodsforsolderabilityandresistancetosolderingheatofdeviceswithleads
【原文标准名称】:环境测试.试验.试验T.含铅装置热钎焊阻力和软焊性的试验方法
【标准号】:BSEN60068-2-20-2008
【标准状态】:现行
【国别】:英国
【发布日期】:2009-01-31
【实施或试行日期】:2009-01-31
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:老化;钎焊;时计;元部件;组件;定义;描述;电气元件;电气工程;电学;电子工程;电子设备及元件;环境;环境测试;最终测量法;扁平连接器;助熔剂(材料);初始测量;叠层板材;材料测试;无铅;印制电路;印制电路板;软钎焊性;软钎焊;耐钎焊温度;焊锡;规范;样品;温度;试验组;测试;焊接工程
【英文主题词】:Ageing(materials);Brazing;Chronometers;Components;Definition;Definitions;Descriptions;Electricalcomponents;Electricalengineering;Electricity;Electronicengineering;Electronicequipmentandcomponents;Environment;Environmentaltesting;Finalmeasurements;Flatconnectors;Fluxes(materials);Initialmeasurements;Laminates;Materialstesting;Non-leaded;Printedcircuits;Printed-circuitboards;Solderability;Soldering;Solderingtemperatureresistance;Solderings;Solders;Specification;Specimens;Temperature;Testgroup;Testing;Weldingengineering
【摘要】:ThispartofIEC60068outlinesTestT,applicabletodeviceswithleads.Solderingtestsforsurfacemountingdevices(SMD)aredescribedinIEC60068-2-58.Thisstandardprovidesproceduresfordeterminingthesolderabilityandresistancetosolderingheatofdevicesinapplicationsusingsolderalloys,whichareeutecticorneareutectictinlead(Pb),orlead-freealloys.Theproceduresinthisstandardincludethesolderbathmethodandsolderingironmethod.TheobjectiveofthisstandardistoensurethatcomponentleadorterminationsolderabilitymeetstheapplicablesolderjointrequirementsofIEC61191-3andIEC61191-4.Inaddition,testmethodsareprovidedtoensurethatthecomponentbodycanresistagainsttheheatloadtowhichitisexposedduringsoldering.NOTEInformationaboutwettingtimeandwettingforcecanbeobtainedbytestmethodsusingawettingbalance.SeeIEC60068-2-54(solderbathmethod)andIEC60068-2-69(solderbathandsolderglobulemethodforSMDs).
【中国标准分类号】:A21
【国际标准分类号】:19_040
【页数】:24P.;A4
【正文语种】:英语
【原文标准名称】:环境测试.试验.试验T.含铅装置热钎焊阻力和软焊性的试验方法
【标准号】:BSEN60068-2-20-2008
【标准状态】:现行
【国别】:英国
【发布日期】:2009-01-31
【实施或试行日期】:2009-01-31
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:老化;钎焊;时计;元部件;组件;定义;描述;电气元件;电气工程;电学;电子工程;电子设备及元件;环境;环境测试;最终测量法;扁平连接器;助熔剂(材料);初始测量;叠层板材;材料测试;无铅;印制电路;印制电路板;软钎焊性;软钎焊;耐钎焊温度;焊锡;规范;样品;温度;试验组;测试;焊接工程
【英文主题词】:Ageing(materials);Brazing;Chronometers;Components;Definition;Definitions;Descriptions;Electricalcomponents;Electricalengineering;Electricity;Electronicengineering;Electronicequipmentandcomponents;Environment;Environmentaltesting;Finalmeasurements;Flatconnectors;Fluxes(materials);Initialmeasurements;Laminates;Materialstesting;Non-leaded;Printedcircuits;Printed-circuitboards;Solderability;Soldering;Solderingtemperatureresistance;Solderings;Solders;Specification;Specimens;Temperature;Testgroup;Testing;Weldingengineering
【摘要】:ThispartofIEC60068outlinesTestT,applicabletodeviceswithleads.Solderingtestsforsurfacemountingdevices(SMD)aredescribedinIEC60068-2-58.Thisstandardprovidesproceduresfordeterminingthesolderabilityandresistancetosolderingheatofdevicesinapplicationsusingsolderalloys,whichareeutecticorneareutectictinlead(Pb),orlead-freealloys.Theproceduresinthisstandardincludethesolderbathmethodandsolderingironmethod.TheobjectiveofthisstandardistoensurethatcomponentleadorterminationsolderabilitymeetstheapplicablesolderjointrequirementsofIEC61191-3andIEC61191-4.Inaddition,testmethodsareprovidedtoensurethatthecomponentbodycanresistagainsttheheatloadtowhichitisexposedduringsoldering.NOTEInformationaboutwettingtimeandwettingforcecanbeobtainedbytestmethodsusingawettingbalance.SeeIEC60068-2-54(solderbathmethod)andIEC60068-2-69(solderbathandsolderglobulemethodforSMDs).
【中国标准分类号】:A21
【国际标准分类号】:19_040
【页数】:24P.;A4
【正文语种】:英语
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